What it is
Who Makes an AI Rack
A supplier ring lists every company that supplies a component of one AI platform, from the accelerator chip to the quick disconnects on the cooling loop, with where each part is made and whether any of it is made in the US.
- Scope: nine rack-scale and pod-scale platforms from Nvidia, Google, AWS, Microsoft, AMD, Huawei and Cerebras, each broken into 18 components.
- US lens: each row is marked made in the US, some US volume, US production planned with a date, made abroad, or not disclosed.
- Evidence: each row carries its source and whether it rests on a company statement, a teardown or an analyst report.
- Not a directory: suppliers appear only where they are tied to a named platform.
Platforms
Nine Platforms, 18 Components Each
| Platform | Accelerator | Accelerators | Rows | Components with US production | US planned | Not disclosed |
|---|---|---|---|---|---|---|
| Nvidia GB200 NVL72Nvidia | B200 | 72 | 40 | 1 | 0 | 3 |
| Nvidia GB300 NVL72Nvidia | B300 (Blackwell Ultra) | 72 | 52 | 3 | 0 | 2 |
| Nvidia Vera Rubin NVL72Nvidia | Rubin | 72 | 52 | 1 | 0 | 5 |
| Google TPU v7 IronwoodGoogle with Broadcom | TPU v7 Ironwood | 9216 | 32 | 0 | 1 | 10 |
| AWS Trainium3 UltraServerAmazon (Annapurna Labs) | Trainium3 | 144 | 36 | 1 | 0 | 8 |
| Microsoft Maia 200Microsoft | Maia 200 | Not disclosed | 19 | 0 | 0 | 13 |
| AMD HeliosAMD | Instinct MI450 / MI455X | 72 | 30 | 0 | 0 | 12 |
| Huawei CloudMatrix 384Huawei | Ascend 910C | 384 | 21 | 0 | 0 | 0 |
| Cerebras CS-3Cerebras | WSE-3 wafer-scale engine | 1 | 18 | 2 | 0 | 15 |
Findings
Assembled in America, Made in Asia
- Rows: 300 supplier rows; two made in the US, six with some US volume, two planned, 161 made abroad and 129 not disclosed.
- Headquarters: 130 of the named rows are Taiwanese companies, 59 American, 20 Chinese, 14 Korean and five Japanese.
- US production now: TSMC Arizona GB300 wafers, Wistron's Fort Worth GB300 compute trays, Supermicro rack builds in San Jose and Flex's Cerebras lines in Milpitas. Coherent makes lasers in Sherman, Texas, but where its transceivers are assembled is not disclosed.
- Still offshore: advanced packaging, HBM, PCBs and substrates, power shelves and cold plates; Amkor Arizona packaging starts in 2028 and SK hynix Indiana HBM in late 2029.
- China: Huawei's CloudMatrix 384 runs on TSMC dies and Samsung HBM from pre-ban stockpiles, with SMIC and CXMT as domestic replacements; Chinese firms also supply optics and PCBs to US platforms.
Record
Dataset Record
- Dataset
- Supplier rings for nine AI platforms: 300 rows, 79 suppliers
- Sources
- Company filings and press releases, SemiAnalysis, TrendForce, DigiTimes, KGI and Morgan Stanley via Taiwan press, TechInsights; source link on each row
- Last verified
- October 2026