At a glance
Platform Summary
64-chip racks joined by optical circuit switches into one superpod. See Cluster Layer.
| Item | Value |
|---|---|
| Designer | Google with Broadcom |
| Accelerator | TPU v7 Ironwood |
| Host CPU | Not disclosed |
| Accelerators per unit | 9216 (Superpod) |
| Scale-up fabric | Inter-chip interconnect plus optical circuit switches |
| Scale-out fabric | Google data center network |
| Cooling | Direct-to-chip liquid |
| Power (kW) | About 10 MW per superpod |
| Status | Shipping, volume from 2025-H2 |
Supplier ring
Who Makes Each Component
| Component | Supplier | Role | Made in | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Accelerator | TSMC | Sole | TaiwanTSMC Fab 18, Tainan | Made abroad | Claimed Source | N3P wafer fab; no reported TSMC Arizona volume for Ironwood |
| Accelerator | Broadcom | Primary | Taiwan | Made abroad | Claimed Source | ASIC design partner on training TPU v7p; SerDes IP; contract reported through 2031 |
| Accelerator | MediaTek | Second source | Taiwan | Made abroad | Claimed Source | Reported I/O and SerDes design for cost-reduced TPU v7e; not confirmed by Google |
| CPU | Not disclosed | Primary | Not disclosed | Committed Source | 224-vCPU host per four TPUs; Google does not name the processor | |
| HBM | Samsung | Primary | South Korea | Made abroad | Claimed Source | About 60% of Ironwood HBM3E via Broadcom; eight stacks and 192 GB per chip |
| HBM | SK hynix | Second source | South Korea | Made abroad | Claimed Source | About 40% share; SK hynix Indiana HBM packaging plant not yet producing |
| Advanced packaging | TSMC | Sole | Taiwan | Made abroad | Claimed Source | CoWoS; two compute dies per package |
| PCB and substrate | Gold Circuit Electronics | Primary | Taiwan | Made abroad | Claimed Source | 30-40 layer high-end PCB for TPU v7 |
| PCB and substrate | Elite Material | Primary | Taiwan | Made abroad | Claimed Source | High-end copper clad laminate |
| PCB and substrate | Ibiden | Primary | Japan | Made abroad | Claimed Source | ABF package substrate |
| PCB and substrate | Unimicron | Second source | Taiwan | Made abroad | Claimed Source | ABF substrate for Google servers |
| PCB and substrate | Shinko Electric | Second source | Japan | Made abroad | Claimed Source | ABF package substrate |
| Compute tray ODM | Inventec | Primary | Not disclosed | Claimed Source | Primary confirmed TPU ODM per analyst; also main TPU v6 supplier | |
| Compute tray ODM | Foxconn | Second source | Not disclosed | Claimed Source | CPU host compute trays at one per TPU rack; Wisconsin plant builds Google server parts since 2020 | |
| Compute tray ODM | Wiwynn | Second source | Malaysia | Made abroad | Claimed Source | Expanding ASIC server SMT capacity; Quanta and Mitac also competing for allocation |
| Rack integration | Celestica | Primary | United StatesDallas-Fort Worth TX | US planned | Committed Source | Celestica US capacity for Google TPU systems due 2027 in the Dallas-Fort Worth area |
| Scale-up switch | GoogleIn-house MEMS optical circuit switch; Celestica builds | Primary | Not disclosed | Claimed Source | In-house 300-port MEMS OCS; about 12000 units in 2026; ICI is on-die | |
| Scale-up switch | Lumentum | Second source | Not disclosed | Claimed Source | External MEMS OCS; shares about 3000 external units with Coherent | |
| Scale-up switch | Coherent | Second source | Not disclosed | Claimed Source | External digital liquid crystal OCS | |
| Scale-up cabling | BizLink | Primary | Not disclosed | Claimed Source | Intra-rack ICI is copper; cable role per Taiwan broker summary | |
| Scale-out NIC | Not disclosed | Primary | Not disclosed | Committed Source | 100 Gbps data center network per chip; NIC vendor not named | |
| Optical transceivers | InnoLight | Primary | China | Made abroad | Claimed Source | About 80% of Google 800G-plus orders in 2026 per TrendForce |
| Optical transceivers | Eoptolink | Second source | Thailand | Made abroad | Claimed Source | Remainder of 800G-plus orders |
| Optical transceivers | LandMark Optoelectronics | Second source | Taiwan | Made abroad | Claimed Source | Laser chip supplier in TPU v7 qualification; Morgan Stanley list |
| Power shelf | Delta Electronics | Primary | Not disclosed | Claimed Source | Named TPU power supplier in Taiwan broker summary | |
| Rack busbar and power distribution | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Battery backup and capacitors | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Coolant distribution unit | Not disclosed | Primary | Not disclosed | Committed Source | Google-designed in-row CDUs; six per rack with N+1; maker not named | |
| Coolant distribution unit | Envicool | Second source | China | Made abroad | Claimed Source | In talks only per Reuters; not a confirmed supplier |
| Cold plates and manifolds | Asia Vital Components (AVC) | Primary | Not disclosed | Claimed Source | Liquid cooling for Google AI servers; bare-die split-flow cold plates | |
| Quick disconnects | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Rack enclosure | Not disclosed | Primary | Not disclosed | Claimed | No vendor found |
US share
What Is Made in the US
- Rack integration: Celestica, Dallas-Fort Worth TX. US planned.
Record
Dataset Record
- Dataset
- Supplier ring for Google TPU v7 Ironwood: 32 rows across 18 components
- Sources
- Company filings and press releases, SemiAnalysis, TrendForce, DigiTimes, KGI and Morgan Stanley via Taiwan press, Nvidia, AMD, Google, AWS, Microsoft, Cerebras; source link on each row
- Last verified
- October 2026