At a glance
Platform Summary
Trainium2 UltraServers power Project Rainier. See Cluster Layer.
| Item | Value |
|---|---|
| Designer | Amazon (Annapurna Labs) |
| Accelerator | Trainium3 |
| Host CPU | Not disclosed |
| Accelerators per unit | 144 (UltraServer) |
| Scale-up fabric | NeuronLink via NeuronSwitch |
| Scale-out fabric | Elastic Fabric Adapter |
| Cooling | Mostly air; about 20% liquid |
| Power (kW) | Not disclosed |
| Status | Ramping, volume from 2026 |
Supplier ring
Who Makes Each Component
| Component | Supplier | Role | Made in | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Accelerator | TSMC | Sole | TaiwanTSMC Fab 18, Tainan | Made abroad | Committed Source | 3 nm; AWS's first 3 nm AI chip; no reported Arizona volume |
| Accelerator | Annapurna Labs (Amazon)Trainium3 design; Alchip back-end design | Primary | Taiwan | Made abroad | Claimed Source | Annapurna front end; Alchip back end on about 70% of Trainium3 wafer starts |
| Accelerator | Marvell | Second source | Taiwan | Made abroad | Claimed Source | Retains a Trainium3 version; designed Trainium2 |
| CPU | Not disclosed | Primary | Not disclosed | Claimed Source | AWS does not name host CPU; Foxconn builds the CPU tray | |
| HBM | SK hynix | Primary | South KoreaIcheon | Made abroad | Claimed Source | 12-high HBM3E; 144 GB per chip; Indiana packaging plant not yet producing |
| HBM | Not disclosed | Second source | Not disclosed | Claimed | Samsung or Micron share on Trainium3 not verified | |
| Advanced packaging | TSMC | Sole | Taiwan | Made abroad | Claimed Source | CoWoS type not stated by AWS |
| PCB and substrate | Gold Circuit Electronics | Primary | Taiwan | Made abroad | Claimed Source | Main UBB PCB supplier per Morgan Stanley |
| PCB and substrate | Elite Material | Primary | Taiwan | Made abroad | Claimed Source | Copper clad laminate |
| PCB and substrate | Taiwan Union Technology (TUC) | Second source | Taiwan | Made abroad | Claimed Source | Copper clad laminate |
| Compute tray ODM | Wiwynn | Primary | Taiwan | Made abroad | Claimed Source | Main L11 assembly plus UBB and switch tray |
| Compute tray ODM | Foxconn | Second source | Not disclosed | Claimed Source | CPU tray | |
| Compute tray ODM | Accton | Second source | Taiwan | Made abroad | Claimed Source | UBB supply alongside Fabrinet and Wiwynn |
| Rack integration | Wiwynn | Primary | United StatesSocorro TX | Some US volume | Claimed Source | Socorro TX plant opened Sep 2026 building Amazon racks; Trainium link not stated |
| Rack integration | Jabil | Second source | Not disclosed | Claimed Source | Takes part of L11 orders; Jabil adding AI rack capacity in Memphis TN | |
| Scale-up switch | Astera Labs | Primary | Taiwan | Made abroad | Claimed Source | Custom Scorpio-X switch silicon for NeuronSwitch-v1; TSMC fabbed |
| Scale-up switch | Wiwynn | Primary | Taiwan | Made abroad | Claimed Source | Main switch tray builder this generation |
| Scale-up switch | Accton | Second source | Taiwan | Made abroad | Claimed Source | Second source switch tray due to capacity limits |
| Scale-up cabling | BizLink | Primary | Not disclosed | Claimed Source | Active electrical cables and power whips | |
| Scale-up cabling | Amphenol | Primary | Not disclosed | Claimed Source | Cable box for Teton PDS and Max racks | |
| Scale-up cabling | TE Connectivity | Second source | Not disclosed | Claimed Source | Cable box second source | |
| Scale-out NIC | Accton | Primary | Taiwan | Made abroad | Claimed Source | NIC boards; EFA and Nitro silicon from Annapurna |
| Scale-out NIC | Universal Scientific Industrial (USI) | Second source | Not disclosed | Claimed Source | NIC boards | |
| Optical transceivers | Not disclosed | Primary | Not disclosed | Claimed | No Trainium3-specific optics vendor found | |
| Power shelf | Delta Electronics | Primary | Not disclosed | Claimed Source | Power content about $40000-45000 per rack; 48V and 800V HVDC | |
| Power shelf | Lite-On | Second source | Not disclosed | Claimed Source | PSU and power systems | |
| Rack busbar and power distribution | BizLink | Primary | Not disclosed | Claimed Source | Power whips; busbar maker not named | |
| Battery backup and capacitors | Advanced Energy Solution (AES-KY) | Primary | Not disclosed | Claimed Source | Battery backup units | |
| Battery backup and capacitors | Dynapack | Second source | Not disclosed | Claimed Source | Battery backup units | |
| Coolant distribution unit | Cooler Master | Primary | Not disclosed | Claimed Source | Rollout mostly air cooled; about 20% liquid | |
| Cold plates and manifolds | Asia Vital Components (AVC) | Primary | Not disclosed | Claimed Source | Main air and liquid thermal supplier | |
| Cold plates and manifolds | Auras | Second source | Not disclosed | Claimed Source | Liquid cooling beneficiary | |
| Cold plates and manifolds | Mai Ke (6831 TT) | Second source | Taiwan | Made abroad | Claimed Source | Named main thermal supplier with AVC |
| Quick disconnects | Fositek | Primary | Not disclosed | Claimed Source | Named liquid cooling beneficiary; QD role inferred from product line | |
| Rack enclosure | Chenbro | Primary | Not disclosed | Claimed Source | Chassis and enclosure; AVC also supplies | |
| Rack enclosure | King Slide | Primary | Taiwan | Made abroad | Claimed Source | Server rails |
US share
What Is Made in the US
- Rack integration: Wiwynn, Socorro TX. Some US volume.
Record
Dataset Record
- Dataset
- Supplier ring for AWS Trainium3 UltraServer: 36 rows across 18 components
- Sources
- Company filings and press releases, SemiAnalysis, TrendForce, DigiTimes, KGI and Morgan Stanley via Taiwan press, Nvidia, AMD, Google, AWS, Microsoft, Cerebras; source link on each row
- Last verified
- October 2026