At a glance
Platform Summary
OCP Open Rack Wide; Sanmina builds from former ZT Systems plants. See Rack Layer.
| Item | Value |
|---|---|
| Designer | AMD |
| Accelerator | Instinct MI450 / MI455X |
| Host CPU | EPYC Venice |
| Accelerators per unit | 72 (One double-wide rack) |
| Scale-up fabric | UALink over Ethernet |
| Scale-out fabric | Pensando Vulcano 800G |
| Cooling | Direct-to-chip liquid |
| Power (kW) | Not disclosed |
| Status | Ramping, volume from 2026-H2 |
Supplier ring
Who Makes Each Component
| Component | Supplier | Role | Made in | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Accelerator | TSMCN2; MI450/MI455X compute dies | Sole | Taiwan | Made abroad | Claimed Source | MI450 on 2nm in production since Q3 2026; TSMC Arizona not producing N2 yet |
| CPU | TSMCN2; EPYC Venice | Sole | Taiwan | Made abroad | Committed Source | AMD validated the prior Turin generation at TSMC Arizona Fab 21; Venice N2 is Taiwan-made |
| HBM | SamsungHBM4 | Primary | South Korea | Made abroad | Committed Source | MOU names Samsung as primary MI455X HBM4 supplier but not exclusive; 1c DRAM with 4nm base die |
| HBM | Not disclosedSK hynix or Micron possible | Second source | Not disclosed | Claimed Source | No second HBM4 source confirmed for MI455X | |
| Advanced packaging | TSMCCoWoS | Primary | Taiwan | Made abroad | Claimed Source | MI450 packaging; AMD also evaluating fan-out panel-level packaging |
| Advanced packaging | ASE | Primary | Taiwan | Made abroad | Committed Source | EFB 2.5D bridge packaging tied to Venice CPU |
| Advanced packaging | SPIL | Second source | Taiwan | Made abroad | Committed Source | EFB 2.5D bridge packaging development for Venice |
| Advanced packaging | Powertech Technology (PTI) | Second source | Taiwan | Made abroad | Committed Source | Qualified first panel-based EFB interconnect for Venice volume |
| PCB and substrate | Unimicron | Primary | Taiwan | Made abroad | Committed Source | Package substrates |
| PCB and substrate | Nan Ya PCB | Second source | Taiwan | Made abroad | Committed Source | Package substrates |
| PCB and substrate | Kinsus | Second source | Taiwan | Made abroad | Committed Source | Package substrates |
| Compute tray ODM | SanminaFormer ZT Systems manufacturing | Primary | Not disclosed | Claimed Source | AMD rack-scale build partner from former ZT Systems plants; Helios build site not disclosed | |
| Compute tray ODM | Wiwynn | Second source | Not disclosed | Committed Source | Named Helios infrastructure partner; build country not disclosed | |
| Compute tray ODM | Wistron | Second source | Not disclosed | Committed Source | Named as building Helios-based systems | |
| Compute tray ODM | Inventec | Second source | Not disclosed | Committed Source | Named as building Helios-based systems | |
| Compute tray ODM | Foxconn | Second source | Not disclosed | Claimed Source | MI450 server assembly for Microsoft and Oracle per press report | |
| Rack integration | Sanmina | Primary | Not disclosed | Committed Source | AMD rack-scale build partner from former ZT Systems plants; Helios build site not disclosed | |
| Rack integration | Wiwynn | Second source | Not disclosed | Committed Source | OEM channel also includes HPE Lenovo Supermicro and Bull | |
| Scale-up switch | Celestica | Primary | Not disclosed | Committed Source | Designs and builds UALoE scale-up switches; manufacturing site not disclosed | |
| Scale-up switch | HPEJuniper switch with Broadcom Tomahawk 6 | Second source | Not disclosed | Committed Source | HPE Helios variant; Tomahawk 6 ASIC is TSMC-fabbed | |
| Scale-up cabling | Not disclosed | Primary | Not disclosed | Claimed | No cabling supplier named for UALoE | |
| Scale-out NIC | AMDPensando Vulcano 800G NIC | Sole | Not disclosed | Committed Source | Three NICs per GPU; foundry not disclosed; Salina DPU on front end | |
| Optical transceivers | Not disclosed | Primary | Not disclosed | Claimed | No optics supplier named | |
| Power shelf | Not disclosed | Primary | Not disclosed | Claimed | No power shelf supplier named | |
| Rack busbar and power distribution | Not disclosed | Primary | Not disclosed | Claimed | No busbar supplier named | |
| Battery backup and capacitors | Not disclosed | Primary | Not disclosed | Claimed | No BBU supplier named | |
| Coolant distribution unit | Schneider Electric (Motivair)MCDU-70 | Primary | Not disclosed | Committed Source | MCDU-70 named in the Helios reference design; manufacturing site not stated | |
| Cold plates and manifolds | FoxconnThermal modules | Primary | Not disclosed | Claimed Source | Thermal modules for AMD MI450 servers per press report | |
| Quick disconnects | Not disclosed | Primary | Not disclosed | Claimed | No QD supplier named | |
| Rack enclosure | AIC | Primary | Taiwan | Made abroad | Committed Source | Helios rack mechanical and compute tray design; OCP Open Rack Wide |
US share
What Is Made in the US
- No component of this platform is made, or planned to be made, in the US on current evidence.
Record
Dataset Record
- Dataset
- Supplier ring for AMD Helios: 30 rows across 18 components
- Sources
- Company filings and press releases, SemiAnalysis, TrendForce, DigiTimes, KGI and Morgan Stanley via Taiwan press, Nvidia, AMD, Google, AWS, Microsoft, Cerebras; source link on each row
- Last verified
- October 2026