At a glance
Platform Summary
All-optical scale-up with 6912 LPO transceivers; Atlas 950 SuperPoD with 8192 chips due Q4 2026. See Cluster Layer.
| Item | Value |
|---|---|
| Designer | Huawei |
| Accelerator | Ascend 910C |
| Host CPU | Kunpeng |
| Accelerators per unit | 384 (16 racks (12 compute and 4 switch)) |
| Scale-up fabric | Huawei UB fabric over optics |
| Scale-out fabric | 400G per NPU |
| Cooling | Not confirmed |
| Power (kW) | About 559 for the system |
| Status | Shipping, volume from 2025 |
Supplier ring
Who Makes Each Component
| Component | Supplier | Role | Made in | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Accelerator | TSMCN7 dies via Sophgo proxy; pre-ban stockpile | Primary | Taiwan | Made abroad | Measured Source | TechInsights teardown found TSMC dies; about 2.9M dies were stockpiled before the TSMC cutoff |
| Accelerator | SMICN+2 7 nm-class dies | Second source | ChinaShanghai, Shenzhen, Beijing | Made abroad | Claimed Source | Domestic substitution for TSMC dies; yields remain a constraint |
| CPU | HuaweiHiSilicon Kunpeng CPU | Sole | Made abroad | Committed Source | Four Kunpeng CPUs per eight-NPU node; foundry not disclosed | |
| HBM | SamsungHBM2E stockpile | Primary | South Korea | Made abroad | Measured Source | Pre-ban stockpile of about 11.7-13M stacks; also re-exported via the CoAsia and Faraday route |
| HBM | SK hynixHBM2E | Second source | South Korea | Made abroad | Measured Source | Found in teardown; SK hynix says it stopped dealing with Huawei in 2020 |
| HBM | CXMT | Second source | China | Made abroad | Claimed Source | Domestic substitution; about 2.2M stacks projected for 2026 |
| Advanced packaging | Not disclosed | Primary | China | Made abroad | Claimed | Domestic OSAT unconfirmed; JCET and Tongfu pack CXMT memory |
| PCB and substrate | Not disclosed | Primary | China | Made abroad | Claimed Source | Atlas 950 SuperPoD with 8192 Ascend 950 chips and in-house HiBL/HiZQ HBM is due Q4 2026 |
| Compute tray ODM | Huawei | Sole | China | Made abroad | Claimed Source | Huawei designs and builds its own nodes |
| Rack integration | Huawei | Sole | China | Made abroad | Claimed Source | 16 racks: 12 compute and 4 scale-up switch racks |
| Scale-up switch | HuaweiUB switch ASIC | Sole | Made abroad | Committed Source | Seven UB switch ASICs per node plus a UB spine tier; foundry not disclosed | |
| Scale-up cabling | Not disclosed | Primary | China | Made abroad | Claimed Source | Scale-up runs over optics rather than copper |
| Scale-out NIC | Not disclosed | Primary | Made abroad | Claimed Source | 400G scale-out per NPU; Atlas 950 SuperPoD shifts to Hi-ONE NPO optics | |
| Optical transceivers | Not disclosedHuawei in-house or Chinese module makers | Primary | China | Made abroad | Claimed Source | 6912 x 400G LPO; InnoLight and Eoptolink roles unverified |
| Power shelf | Not disclosed | Primary | China | Made abroad | Claimed | System draws about 600 kW; Huawei Digital Power use unconfirmed |
| Rack busbar and power distribution | Not disclosed | Primary | China | Made abroad | Claimed | |
| Battery backup and capacitors | Not disclosed | Primary | China | Made abroad | Claimed | |
| Coolant distribution unit | Not disclosed | Primary | China | Made abroad | Claimed | Cooling method not confirmed in sources |
| Cold plates and manifolds | Not disclosed | Primary | China | Made abroad | Claimed | |
| Quick disconnects | Not disclosed | Primary | China | Made abroad | Claimed | |
| Rack enclosure | Not disclosed | Primary | China | Made abroad | Claimed |
US share
What Is Made in the US
- No component of this platform is made, or planned to be made, in the US on current evidence.
Record
Dataset Record
- Dataset
- Supplier ring for Huawei CloudMatrix 384: 21 rows across 18 components
- Sources
- Company filings and press releases, SemiAnalysis, TrendForce, DigiTimes, KGI and Morgan Stanley via Taiwan press, Nvidia, AMD, Google, AWS, Microsoft, Cerebras; source link on each row
- Last verified
- October 2026