At a glance
Platform Summary
Inference accelerator in a Microsoft-designed wide rack. See Rack Layer.
| Item | Value |
|---|---|
| Designer | Microsoft |
| Accelerator | Maia 200 |
| Host CPU | Cobalt 200 |
| Accelerators per unit | Not disclosed (Rack) |
| Scale-up fabric | Two-tier Ethernet |
| Scale-out fabric | On-die Ethernet NIC |
| Cooling | Closed-loop liquid with sidekick heat exchanger |
| Power (kW) | Not disclosed |
| Status | Deploying, volume from 2026 |
Supplier ring
Who Makes Each Component
| Component | Supplier | Role | Made in | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Accelerator | TSMC | Sole | TaiwanTSMC Fab 18, Tainan | Made abroad | Committed Source | N3P; about 144B transistors; no reported Arizona volume |
| Accelerator | Global Unichip (GUC) | Primary | Taiwan | Made abroad | Claimed Source | ASIC design service; also helped CoWoS-S design |
| CPU | MicrosoftCobalt 200 Arm CPU | Sole | Taiwan | Made abroad | Committed Source | One Arm host CPU per four-accelerator blade; TSMC 3 nm |
| HBM | SK hynix | Sole | South Korea | Made abroad | Claimed Source | Six 12-high HBM3E stacks; 216 GB; Indiana plant not yet producing |
| Advanced packaging | TSMC | Sole | Taiwan | Made abroad | Claimed Source | CoWoS-S |
| PCB and substrate | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Compute tray ODM | Not disclosed | Primary | Not disclosed | Claimed Source | Foxconn and Quanta named as Azure AI ODMs but not tied to Maia | |
| Rack integration | Not disclosed | Primary | Not disclosed | Claimed | Microsoft-designed wide rack; integrator not named | |
| Scale-up switch | Not disclosed | Primary | Not disclosed | Committed Source | Two-tier Ethernet ATL fabric; switch silicon vendor not named | |
| Scale-up cabling | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Scale-out NIC | MicrosoftOn-die integrated NIC | Sole | Taiwan | Made abroad | Committed Source | 56 lanes of 400G SerDes on die; no discrete NIC |
| Optical transceivers | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Power shelf | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Rack busbar and power distribution | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Battery backup and capacitors | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Coolant distribution unit | Not disclosed | Primary | Not disclosed | Committed Source | Second-gen closed-loop sidekick heat exchanger unit; Microsoft design; maker not named | |
| Cold plates and manifolds | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Quick disconnects | Not disclosed | Primary | Not disclosed | Claimed | No vendor found | |
| Rack enclosure | Not disclosed | Primary | Not disclosed | Committed Source | Microsoft-designed wider-than-standard rack; fabricator not named |
US share
What Is Made in the US
- No component of this platform is made, or planned to be made, in the US on current evidence.
Record
Dataset Record
- Dataset
- Supplier ring for Microsoft Maia 200: 19 rows across 18 components
- Sources
- Company filings and press releases, SemiAnalysis, TrendForce, DigiTimes, KGI and Morgan Stanley via Taiwan press, Nvidia, AMD, Google, AWS, Microsoft, Cerebras; source link on each row
- Last verified
- October 2026