At a glance
Platform Summary
Adds battery backup and capacitor shelves; first US-assembled trays at Wistron Fort Worth. See Rack Layer.
| Item | Value |
|---|---|
| Designer | Nvidia |
| Accelerator | B300 (Blackwell Ultra) |
| Host CPU | Grace |
| Accelerators per unit | 72 (One rack) |
| Scale-up fabric | NVLink 5 (nine switch trays) |
| Scale-out fabric | ConnectX-8; InfiniBand or Spectrum-X Ethernet |
| Cooling | Direct-to-chip liquid |
| Power (kW) | About 135-140 |
| Status | Shipping, volume from 2025-H2 |
Supplier ring
Who Makes Each Component
| Component | Supplier | Role | Made in | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Accelerator | NvidiaB300 GPU; TSMC 4NP | Primary | TaiwanTSMC Taiwan | Made abroad | Claimed Source | Blackwell Ultra |
| Accelerator | TSMCArizona | Second source | United StatesTSMC Fab 21, Phoenix AZ | Some US volume | Committed Source | Blackwell wafers in volume; specific SKU not disclosed |
| CPU | NvidiaGrace CPU; TSMC 4N | Sole | TaiwanTSMC Taiwan | Made abroad | Claimed Source | Same Grace as GB200 |
| HBM | SK hynix | Primary | South KoreaIcheon and Cheongju | Made abroad | Claimed Source | HBM3E 12-high; early exclusive reported |
| HBM | Micron | Second source | Japan, TaiwanHiroshima DRAM; Taichung packaging | Made abroad | Claimed Source | 12-high HBM3E delivering for B300 |
| HBM | Samsung | Second source | South KoreaPyeongtaek and Cheonan | Made abroad | Claimed Source | 12-high qualified Sep 2025; limited volume |
| Advanced packaging | TSMCCoWoS-L | Primary | TaiwanZhunan AP6 and Tainan AP8 | Made abroad | Claimed Source | Arizona wafers return to Taiwan for CoWoS |
| Advanced packaging | Amkor | Second source | Made abroad | Committed Source | Amkor Peoria AZ production starts 2028, after GB300; not a disclosed GB300 packager | |
| Advanced packaging | SPIL | Second source | Taiwan | Not disclosed | Claimed Source | Arizona site in final planning; no date |
| PCB and substrate | Doosan Electro-Materials | Sole | South Korea | Made abroad | Claimed Source | Exclusive compute-tray CCL |
| PCB and substrate | WUS Printed Circuit | Primary | China | Made abroad | Claimed Source | Compute UBB and switch tray PCB |
| PCB and substrate | Ibiden | Primary | Japan | Made abroad | Claimed Source | ABF package substrate; not GB300-specific |
| PCB and substrate | TTM Technologies | Second source | Not disclosed | Claimed Source | Source names HGX B300 baseboards; NVL72 board role and plant not confirmed | |
| PCB and substrate | Victory Giant Technology | Second source | China, ThailandHuizhou | Made abroad | Claimed Source | Low-end 16-layer HDI OAM |
| PCB and substrate | Unimicron | Second source | Taiwan | Made abroad | Claimed Source | HDI OAM |
| Compute tray ODM | Wistron | Primary | United States, TaiwanWistron D1, Fort Worth TX | Some US volume | Committed Source | D1 opened Jul 2026 building GB300; tens of thousands boards/month |
| Compute tray ODM | Foxconn | Primary | Mexico, TaiwanGuadalajara Mexico | Made abroad | Claimed Source | Current output offshore |
| Compute tray ODM | Foxconn | Second source | United StatesHouston TX | US planned | Committed Source | Houston plant named by Nvidia for US AI server builds; fit-out Sep 2026 to Jan 2027; GB300 scope unconfirmed |
| Compute tray ODM | Quanta | Second source | Taiwan | Not disclosed | Claimed Source | US filings products unspecified |
| Rack integration | Foxconn | Primary | Mexico, TaiwanGuadalajara Mexico | Made abroad | Claimed Source | GB demand seen through 2027 |
| Rack integration | Quanta | Second source | Taiwan, United StatesFremont CA | Not disclosed | Claimed Source | $157M Newark and $91M Fremont filings |
| Rack integration | Wiwynn | Second source | Mexico, Malaysia | Not disclosed | Claimed Source | No US site found |
| Rack integration | Inventec | Second source | Mexico, Taiwan, United StatesKaty TX | Not disclosed | Claimed Source | Katy TX factory acquired; products unspecified |
| Rack integration | Pegatron | Second source | Taiwan, United StatesGeorgetown TX | Not disclosed | Claimed Source | Mass production targeted 2H 2026; unverified |
| Rack integration | Supermicro | Second source | United States, Taiwan, MalaysiaSan Jose CA | Some US volume | Claimed Source | Supermicro builds racks in San Jose CA; share of this platform built there not disclosed |
| Rack integration | Dell | Second source | Not disclosed | Claimed Source | Build site not disclosed | |
| Rack integration | HPE | Second source | Not disclosed | Committed Source | Product offered; build site not disclosed | |
| Scale-up switch | NvidiaNVLink 5 Switch | Sole | TaiwanTSMC Taiwan | Made abroad | Claimed Source | Switch tray PCB unchanged from GB200 |
| Scale-up cabling | Amphenol | Primary | Not disclosed | Claimed Source | Carried from GB200 Oberon spine; GB300 award not confirmed | |
| Scale-out NIC | NvidiaConnectX-8 | Sole | TaiwanTSMC Taiwan | Made abroad | Claimed Source | 800G SuperNIC |
| Optical transceivers | Fabrinet | Primary | ThailandChonburi | Made abroad | Claimed Source | Supplier lineup carried from GB200 |
| Optical transceivers | InnoLight | Primary | China, Thailand | Made abroad | Claimed Source | |
| Optical transceivers | Eoptolink | Second source | China, Thailand | Made abroad | Claimed Source | |
| Optical transceivers | Coherent | Second source | United StatesSherman TX (lasers only) | Not disclosed | Committed Source | InP lasers made in Sherman TX; transceiver assembly site not disclosed |
| Power shelf | Delta Electronics | Primary | Thailand, China | Made abroad | Claimed Source | 8-10 33kW shelves per rack |
| Power shelf | Lite-On | Second source | Made abroad | Claimed Source | ||
| Power shelf | Megmeet | Second source | China | Made abroad | Claimed Source | |
| Power shelf | Flex | Second source | Not disclosed | Claimed Source | GB300 datasheet listed; build site not stated | |
| Rack busbar and power distribution | Not disclosed | Primary | Not disclosed | Claimed Source | Busbar and PDB suppliers paywalled | |
| Battery backup and capacitors | Delta Electronics | Primary | Made abroad | Claimed Source | BBU shelves and supercapacitors from shelf vendors | |
| Battery backup and capacitors | Dynapack | Primary | Taiwan | Made abroad | Claimed Source | Major BBU lithium module vendor |
| Battery backup and capacitors | Lite-On | Second source | Made abroad | Claimed Source | BBU shelves and supercapacitors | |
| Battery backup and capacitors | Advanced Energy Solution (AES-KY) | Second source | Taiwan | Made abroad | Claimed Source | BBU lithium modules |
| Battery backup and capacitors | Sysgration | Second source | United StatesPlano TX | Not disclosed | Claimed Source | AI server BBU volume targeted 2H 2026; NVL72 tie unconfirmed |
| Coolant distribution unit | Delta Electronics | Primary | Thailand, China | Made abroad | Claimed Source | Over 50% of L2A sidecar market |
| Coolant distribution unit | Not disclosedL2L CDU | Primary | Not disclosed | Claimed Source | No GB300-specific L2L CDU award found | |
| Cold plates and manifolds | Auras | Primary | Made abroad | Claimed Source | Fully liquid-cooled tray adds cold plates | |
| Cold plates and manifolds | Asia Vital Components (AVC) | Primary | Made abroad | Claimed Source | ||
| Quick disconnects | Fositek | Primary | Taiwan | Made abroad | Claimed Source | UQD mass production for GB300; supply tight |
| Quick disconnects | Global Tek | Second source | Taiwan | Made abroad | Claimed Source | GB300 UQD was in final development |
| Rack enclosure | Chenbro | Primary | Taiwan | Made abroad | Claimed Source | Rack and chassis; listing not confirmation |
| Rack enclosure | King Slide | Second source | Taiwan | Made abroad | Claimed Source | Rails |
US share
What Is Made in the US
- Accelerator: TSMC (Arizona), TSMC Fab 21, Phoenix AZ. Some US volume.
- Compute tray ODM: Wistron, Wistron D1, Fort Worth TX. Some US volume.
- Compute tray ODM: Foxconn, Houston TX. US planned.
- Rack integration: Supermicro, San Jose CA. Some US volume.
Record
Dataset Record
- Dataset
- Supplier ring for Nvidia GB300 NVL72: 52 rows across 18 components
- Sources
- Company filings and press releases, SemiAnalysis, TrendForce, DigiTimes, KGI and Morgan Stanley via Taiwan press, Nvidia, AMD, Google, AWS, Microsoft, Cerebras; source link on each row
- Last verified
- October 2026