At a glance
Platform Summary
Renamed from NVL144; Kyber NVL144 with Rubin Ultra follows. See Rack Layer.
| Item | Value |
|---|---|
| Designer | Nvidia |
| Accelerator | Rubin |
| Host CPU | Vera |
| Accelerators per unit | 72 (One rack) |
| Scale-up fabric | NVLink 6 (nine switch blades) |
| Scale-out fabric | ConnectX-9; Spectrum-X Ethernet |
| Cooling | Direct-to-chip liquid |
| Power (kW) | Not disclosed |
| Status | Ramping, volume from 2026-H2 |
Supplier ring
Who Makes Each Component
| Component | Supplier | Role | Made in | US status | Evidence | Notes |
|---|---|---|---|---|---|---|
| Accelerator | NvidiaRubin GPU; TSMC 3 nm | Sole | TaiwanTSMC Taiwan | Made abroad | Claimed Source | Rack renamed NVL72 from NVL144; Kyber NVL144 Rubin Ultra slipped to 2028 |
| CPU | NvidiaVera CPU; TSMC 3 nm | Sole | TaiwanTSMC Taiwan | Made abroad | Claimed Source | 88 Olympus Arm cores |
| HBM | Samsung | Primary | South KoreaPyeongtaek and Cheonan | Made abroad | Claimed Source | HBM4; passed 10-11Gb/s qualification first |
| HBM | SK hynix | Primary | South KoreaIcheon and Cheongju | Made abroad | Claimed Source | HBM4 288GB per GPU |
| HBM | SK hynix | Second source | United StatesWest Lafayette IN | Made abroad | Committed Source | West Lafayette IN plant broke ground Aug 2026; HBM mass production 2H 2029, after Vera Rubin NVL72 |
| HBM | Micron | Second source | Japan, TaiwanHiroshima DRAM; Taichung packaging | Made abroad | Claimed Source | HBM4 aimed at Rubin CPX not flagship |
| Advanced packaging | TSMCCoWoS-L | Primary | TaiwanZhunan AP6 and Tainan AP8 | Made abroad | Claimed Source | CoWoS capacity tight through Rubin ramp |
| Advanced packaging | TSMCArizona | Second source | United StatesTSMC Arizona, Phoenix AZ | Made abroad | Committed Source | First TSMC Arizona packaging plant due before 2029, after Vera Rubin NVL72 volume |
| Advanced packaging | Amkor | Second source | United StatesArizona campus (Peoria) | Made abroad | Committed Source | Amkor Peoria AZ production 2028; no Rubin packaging tie disclosed |
| Advanced packaging | SPIL | Second source | TaiwanDouliu (CoWoS line under construction) | Not disclosed | Claimed Source | Arizona test site decision pending |
| PCB and substrate | Victory Giant Technology | Primary | China, Thailand, VietnamHuizhou | Made abroad | Claimed Source | Rubin sampling partner; 78+ layer boards for Rubin Ultra |
| PCB and substrate | Elite Material | Primary | Made abroad | Claimed Source | CCL | |
| PCB and substrate | Ibiden | Primary | Japan | Made abroad | Claimed Source | ABF substrate; Rubin-specific share not found |
| PCB and substrate | Unimicron | Second source | Taiwan | Made abroad | Claimed Source | VR PCB chain; specific board not stated |
| PCB and substrate | Zhen Ding Tech | Second source | Made abroad | Claimed Source | VR PCB chain | |
| PCB and substrate | Taiwan Union Technology (TUC) | Second source | Made abroad | Claimed Source | CCL | |
| Compute tray ODM | Foxconn | Primary | Mexico, Taiwan | Made abroad | Committed Source | First VR rack shipments Q4 2026; targets 50% share |
| Compute tray ODM | Wistron | Primary | Taiwan, United StatesWistron D1, Fort Worth TX | Not disclosed | Committed Source | VR superchips at Fort Worth later; no date |
| Compute tray ODM | Quanta | Second source | Taiwan | Not disclosed | Claimed Source | Mass shipments from Q3 2026 |
| Rack integration | Foxconn | Primary | Mexico, Taiwan | Made abroad | Committed Source | Volume becomes mainstay in 2027 |
| Rack integration | Foxconn | Second source | United StatesHouston TX | Not disclosed | Committed Source | Houston plant under construction; VR scope not stated |
| Rack integration | Quanta | Second source | Taiwan, United StatesFremont CA | Not disclosed | Claimed Source | Showed VR racks at Computex |
| Rack integration | Wistron | Second source | Taiwan, United StatesWistron D1, Fort Worth TX | Not disclosed | Claimed Source | Showed VR racks at Computex |
| Rack integration | Inventec | Second source | Mexico, Taiwan, United StatesKaty TX | Not disclosed | Claimed Source | Showed VR racks at Computex |
| Rack integration | Wiwynn | Second source | Mexico, Malaysia | Not disclosed | Claimed Source | Listed as VR system partner |
| Rack integration | Supermicro | Second source | United States, Taiwan, MalaysiaSan Jose CA | Some US volume | Committed Source | Supermicro builds racks in San Jose CA; share of this platform built there not disclosed |
| Rack integration | Dell | Second source | Not disclosed | Claimed Source | VR supplier status unconfirmed | |
| Rack integration | HPE | Second source | Not disclosed | Claimed Source | No VR build site found | |
| Scale-up switch | NvidiaNVLink 6 Switch | Sole | TaiwanTSMC Taiwan | Made abroad | Committed Source | Nine switch blades; 3.6 TB/s per GPU |
| Scale-up cabling | Amphenol | Primary | Not disclosed | Claimed Source | Oberon copper spine incumbent; VR award not confirmed | |
| Scale-out NIC | NvidiaConnectX-9 | Sole | TaiwanTSMC Taiwan | Made abroad | Committed Source | 1.6 Tb/s SuperNIC; BlueField-4 DPU alongside |
| Optical transceivers | Fabrinet | Primary | ThailandChonburi | Made abroad | Claimed Source | Spectrum-X Photonics ecosystem; Rubin supply unconfirmed |
| Optical transceivers | Coherent | Second source | United StatesSherman TX (lasers only) | Not disclosed | Committed Source | Sherman lasers feed co-packaged optics; transceiver assembly site not disclosed |
| Optical transceivers | Lumentum | Second source | North Carolina | Not disclosed | Committed Source | Advancing US optics manufacturing with Nvidia |
| Optical transceivers | InnoLight | Second source | China, Thailand | Made abroad | Claimed Source | Incumbent; VR share not found |
| Optical transceivers | Eoptolink | Second source | China, Thailand | Made abroad | Claimed Source | Incumbent; VR share not found |
| Power shelf | Flex | Primary | Not disclosed | Committed Source | 110 kW 3RU shelf; six 18.4 kW PSUs at 52 VDC | |
| Power shelf | Delta Electronics | Primary | Thailand, China | Made abroad | Claimed Source | 800 VDC solutions shown for VR |
| Power shelf | Lite-On | Second source | Made abroad | Claimed Source | 800 VDC solutions shown for VR | |
| Power shelf | Lite-On | Second source | United StatesMcKinney TX | Not disclosed | Committed Source | $919M AI power site; groundbreaking Sep 2026; no start date |
| Rack busbar and power distribution | BizLink | Primary | Not disclosed | Committed Source | AC input and output connectors with Amphenol; busbar maker undisclosed | |
| Battery backup and capacitors | FlexIntegrated energy buffer in power shelf | Primary | Not disclosed | Committed Source | Over 1200 J pulsation buffer per PSU | |
| Battery backup and capacitors | Not disclosedBBU | Primary | Not disclosed | Claimed Source | BBU demand rising; no supplier named | |
| Coolant distribution unit | Supermicro | Primary | Not disclosed | Committed Source | 1.8 MW in-row CDUs N+1 with its VR racks | |
| Coolant distribution unit | Vertiv | Second source | Not disclosed | Claimed Source | Named Nvidia cooling partner; VR CDU award not stated | |
| Cold plates and manifolds | Asia Vital Components (AVC) | Primary | Made abroad | Claimed Source | VR cold plates shipping Q3 2026; Nvidia centralized buying | |
| Cold plates and manifolds | Cooler Master | Second source | Made abroad | Claimed Source | One of four named cold-plate vendors | |
| Cold plates and manifolds | Boyd | Second source | Not disclosed | Claimed Source | One of four named cold-plate vendors | |
| Cold plates and manifolds | Auras | Second source | Made abroad | Claimed Source | One of four named cold-plate vendors | |
| Quick disconnects | Not disclosed | Primary | Not disclosed | Claimed Source | Fositek and Global Tek incumbent on GB300; VR award not found | |
| Rack enclosure | Chenbro | Primary | Taiwan | Made abroad | Claimed Source | VR-compatible rack and chassis shown |
| Rack enclosure | King Slide | Second source | Taiwan | Made abroad | Claimed Source | Server rails |
US share
What Is Made in the US
- Rack integration: Supermicro, San Jose CA. Some US volume.
Record
Dataset Record
- Dataset
- Supplier ring for Nvidia Vera Rubin NVL72: 52 rows across 18 components
- Sources
- Company filings and press releases, SemiAnalysis, TrendForce, DigiTimes, KGI and Morgan Stanley via Taiwan press, Nvidia, AMD, Google, AWS, Microsoft, Cerebras; source link on each row
- Last verified
- October 2026